As computing components with complex spatial layouts become more common, chip packaging technologies rather than lithography are becoming increasingly important, and Samsung Electronics is well aware of this. Its Japan research center in Yokohama will expand staff beyond its original targets.
Image Source: Samsung Electronics
The Samsung research center under construction in Japan should simplify the interaction of Korean specialists with Japanese colleagues representing the interests of manufacturers of materials and equipment for chip packaging. The area of approximately 6,600 sq.m should accommodate more than 100 specialists and will begin work in 2025. The company intends to increase the number of personnel involved in the construction of the research center, as well as personnel and finance specialists.
About $260 million will be spent on the construction of the center, and the Japanese authorities are ready to cover up to half of the amount with their subsidies. The money will be allocated from the Post-5G trust fund, which is intended to finance promising technologies. In addition to the proximity of materials and equipment suppliers, the choice of location for the Samsung research center was also influenced by the possibility of cooperation with local universities. In addition to developing packaging for HBM4 memory chips, this center will also create solutions for 5G networks.
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