The digital project will be ready by the end of this year.
Samsung Electronics, according to the publication The Elecwill have a digital design for the HBM4 chips by the end of this year, and will be able to produce the first samples of such memory, which it will send to its customers, in three or four months. If everything goes according to schedule, the company will be able to set up serial production of HBM4 by the end of 2025, but deliveries in significant quantities will not begin until 2026.
Image source: Samsung Electronics
Unlike SK hynix, which will order the logic part of the HBM4 chip from TSMC for production using 5-nm or 12-nm technology, Samsung will be able to set up its production independently using 4-nm technology. The companies are still divided on the choice of technology for producing memory chips for the HBM4 stack. If Samsung plans to implement the advanced sixth-generation 1c process technology, SK hynix is hesitating between it and the more mature 1b. Samsung will begin preparing production lines for the release of HBM4 from mid-2025, and will be able to set up mass production of such chips by 2026. NVIDIA intends to use HBM4 memory in its Rubin generation accelerators, and its competitor AMD will use it in Instinct MI400 accelerators.
The post Aroged: Samsung to Start Producing HBM4 Memory Next Year appeared first on Aroged.